TY - Type of reference TI - Metaheuristic for the RBDO of the brasure’s joints of an electronic board AU - Hamid Hamdani AU - Abdelkhalak El Hami AU - Bouchaïb Radi AB - In the majority of mechatronic devices, thermal fatigue of solder joints is a mechanism causing failure of the solder joints. This type of failure is the main cause that the lifetime of embedded mechatronics systems is often related. This paper presents a finite element simulation of themechanical behavior of solder joints in an electronic board as well as the application of the CMAES optimization method to increase the reliability of joints. This method is the best evolutionary method for continuous parametric optimization. In particular, she was the winner of the stochastic methods (other ES, but also PSO, Differential Evolution, and other EDAs)[8]. A model of finite element simulation is developed, this model intends to analyze the sequence of failure events in mechatronic devices. In this article, this numerical model is used to estimate the number of fatigue life cycles by modeling the most stressed solder joints, and then the proposed CMAES optimization method is performed to overcome the disadvantage of geometric complexity (difficulty application of gradient methods) of mechatronic components. Numerical results show the increasing of the fatigue life cycle of mechatronic devices. DO - 10.21494/ISTE.OP.2018.0258 JF - Uncertainties and Reliability of Multiphysical Systems KW - Optimization, evolutionary algorithm, mechatronic devices, electronic card, solder joint, CMAES, Optimisation, systèmes mécatroniques, carte éléctronique, joint de brasure, algorithme évolutionnaire, CMAES, L1 - https://www.openscience.fr/IMG/pdf/iste_incertfia18v2n1_5.pdf LA - en PB - ISTE OpenScience DA - 2018/05/16 SN - 2514-569X TT - Métaheuristique pour l’optimisation fiabiliste des joints de brasure d’une carte électronique UR - https://www.openscience.fr/Metaheuristic-for-the-RBDO-of-the-brasure-s-joints-of-an-electronic-board IS - Issue 1 VL - 2 ER -